Proprietary Optical Platform Built on Proven Technology
Scalable solutions that can deliver high optical power at the efficiency and reliability required for next-generation AI data centers utilizing Aeva's proven automative-qualified optical source and silicon photonics technology.
Key Features
High Optical Power
High Efficiency
Low Noise
Narrow Linewidth
High Reliability
Qualified Supply Chain
A Differentiated Technology Platform
High Optical Power and Efficiency
Ability to deliver ultra-high optical power with high efficiency required to address growing bandwidth and power demands of AI data centers.
Precise Wavelength Control
Stable and precise wavelengths for single and multiwavelength solutions.
Low Noise Optical Source
Low relative intensity noise (RIN) and narrow linewidth to maintain high signal fidelity for optical interconnects and lower total system power consumption.
Reliable Devices Designed for High Volume
Engineered for data center lifetimes, with low failures in time (FIT) rate. Leverages high-volume foundry and manufacturing supply chain qualified to meet mass-scale requirements of Aeva's leading auto and industrial customers.
Portfolio of Solutions
Utilizing Aeva's automotive qualified platform, Optical Connectivity offers solutions from chipsets and chip arrays to multiwavelength solutions and multichannel modules for a broad range of AI data center applications.
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UHP Chipsets
Aeva's ultra-high power (UHP) laser delivers high optical power of 350mW or higher at 50˚C, narrow linewidth of less than 500kHz and low RIN of less than -150dB/Hz. This addresses a significant gap for high-volume customer deployments.
SPECTRA
Proprietary multiwavelength array delivers precise software-defined wavelength control of less than 0.1nm over temperature and operating life. When combined with our UHP SOAs, this silicon photonics integrated array meets the rigorous OCI-MSA specifications across wavelength, optical power and efficiency.
MESA
Compact Multichannel External Source Assembly (MESA) offering more than 600mW per channel at 50˚C with integrated low noise drivers that can be readily assembled into the industry standard External Laser Small Form-factor Pluggable (ELSFP) and NPO form factors. Expected in 2027.
Built for Multi-Generation Optical Architectures
Aeva's solutions are designed to enable successive interconnect generations and data center architectures from 400G to 1.6T and beyond.
Transceivers
High-power, narrow linewidth sources for pluggable transceivers, giving optical engine designers the launch power and spectral quality next-generation data center links require.
Near-Packaged Optics (NPO)
Laser sources that efficiently deliver power to NPO engines that are packaged on the board close to the ASIC.
Co-Packaged Optics (CPO)
Pluggable external laser sources for co-packaged optics, so wavelength and power can be maintained, serviced, and upgraded independently of the switch package.